Mechanism and elimination of bending effect in femtosecond laser deep-hole drilling

Micro-hole drilling with femtosecond fiber laser

In this paper, micro-hole drilling in ambient air is presented using fs fiber laser (750 fs & 1030 nm). Micro holes were fabricated in both transparent (glasses) and non-transparent materials (metals and tissues). Hole shape and morphology was characterized and evaluated with optical microscope and scanning electron microscopy (SEM). Debris-free micro holes with good roundness and no thermal da...

Micro-hole drilling and cutting using femtosecond fiber laser

Micro-hole drilling and cutting in ambient air are presented by using a femtosecond fiber laser. At first, the micro-hole drilling was investigated in both transparent (glasses) and nontransparent (metals and tissues) materials. The shape and morphology of the holes were characterized and evaluated with optical and scanning electron microscopy. Debris-free micro-holes with good roundness and no...

Effect of Cooling on Bending Angle and Microstructure in Laser Tube Bending with Circumferential Scanning

Laser tube bending is a flexible forming process. Two irradiation methods of axial and circumferential scanning are generally used to form metal tubes. The two most important disadvantages of circumferential scanning are its lower bending angle and the time interval required between each scan for cooling purpose. In this research, a novel cooling strategy during laser tube bending with circumfe...

Statistics and Time Series Analyses of BTA Deep Hole Drilling

BTA 1 deep hole drilling is a method for producing precision bores with high length to diameter ratios. The long and slender tools feature low torsional and bending stiffness. This may lead to undesirable dynamic disturbances of the machining process usually classified as either chatter vibration or spiralling. Prediction and identification of the causes of these process failures is important f...

Title Influence of substrate heating on hole geometry and spatter area in femtosecond laser drilling of silicon